Chipboard adhesive Hybrid
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ESSVE CHIPBOARD ADHESIVE is a solvent-free SMP adhesive for bonding chipboard subfloors and wooden joists (also works on steel) according to the platform principle. Provides moisture-resistant membrane function and counteracts floor creaking. For indoor and outdoor use.
- For indoor and outdoor use
- Chipboard subfloors, platform floor construction
- Chipboard and floor structures
- Moisture-resistant membrane function
- Helps prevent floor squeaking
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For bonding chipboard sub-flooring, in grooves and wooden joists. Bonding according to the platform principle, gives a moisture-resistant membrane function and counteracts creaking floors. Use in combination with screws according to the
Instructions from the board supplier. Clean up spills with cleaning cloth and water. See also TDS for important application information.
- Waterproof
- Based on hybrid-technology
- Free from solvents, isocyanates and silicon
- Paintable
- Working temperature -10 °C to +40 °C
- Store upright at room temperature max +25°C
Technical Specification
| Application environment | Indoors/Outdoors |
| Eco labelling | EPD |
| Skin formation time | 15-25 |
| Certificate |
|---|
| General Product Safety Regulation (GPSR) |
| Environmental declaration (EPD) |
| Products based on polyurethane or silane-modified polymer, group 1 (EN) |
| Product Data Sheet |
| Product data sheet |
| Safety Data Sheet |
| Safety Data Sheet |
| Technical Document |
| SINTEF_Sponplatelim_hybrid |
| VOC Test report M1 (EN) |